According to Ijiwei.com, from September 21st to 22nd, 2023, the Global Memory Industry Innovation Forum 2023 (GMIF 2023), hosted by the China Semiconductor Investment Alliance and organized by Shenzhen Automotive Electronics Industry Association, with the cooperation of Guangdong Integrated Circuit Industry Association and the Shenzhen Semiconductor Industry Association, and managed by JW Insights Consulting (Xiamen) Co., Ltd., was held in Shenzhen. The forum brings together top enterprises in the memory industry chain and industry leaders to discuss hot topics such as industry product innovation, technological evolution, and coordinated development of the industry chain.
Forging Ahead: Exploring the Construction of a Symbiotic Memory Ecosystem
On the afternoon of September 21st, during the GMIF sub-forum titled “Memory Industry Ecosystem Forum”, representatives from domestic memory industry leaders from the Shanghai Stock Exchange gathered to delve into the localized development of the semiconductor memory industry chain. They shared the latest market dynamics and technological trends while discussing the path toward a mutually beneficial and prosperous ecosystem.
Driven by substantial demand, China has assembled the world's most vibrant cluster of memory chip and module enterprises. As a vital hub in the semiconductor industry, China's local memory enterprises have fully leveraged their proximity to the market and localization advantages. They have transitioned from following trends to pursuing innovative development, achieving remarkable success in the market. Government policy support and financing mechanisms have provided enterprises with more expansion opportunities, further fueling the prosperous development of China's semiconductor industry.
Mr. Zhang Fengbin, Group Leader at the Shanghai Stock Exchange South Center, remarked in his keynote speech: “The Sci-Tech Innovation Board (STAR Market) prioritizes the listing of technology-driven innovative enterprises that align with the national strategy for technological innovation and possess advanced, core technologies. However, these companies need to be self-reliant. We hope that these enterprises fully comprehend the STAR Market’s emphasis on cutting-edge technology. They should clearly define their role in serving the market and chart a course for future development. They must remain committed to enhancing their innovation capabilities and technical expertise, diligently advancing their research and product development efforts. Leveraging the registration-based system, they can achieve substantial leaps in their growth trajectory.”
Mr. Zhang Fengbin, Group Leader at the Shanghai Stock Exchange South Center
During this forum, Mr. Yu Bo, the Marketing Director of Powev Electronic Technology Co., Ltd., delivered a keynote speech, providing insights into Powev’s development and transformation journey. Huang Zhiwei, Vice General Manager of Shenzhen Quanxing Technology Co., Ltd., shared the company's strategic outlook in product layout within the evolving landscape of AI. Representatives from domestic memory controller companies, including Mr. Jin Ye, Deputy General Manager of the memory division at Maxio Technology (Hangzhou) Co., Ltd., and Mr. Han Bingdong, Vice President of Sales at InnoGrit Technologies Co., Ltd. (Shanghai), delivered keynote speeches. They shared their respective practices and innovative achievements in fields such as consumer-grade SSDs and data centers.
With storage technology innovation and diverse market demands driving the local memory industry chain, discussions at the forum revolved around how equipment, materials, and packaging in the local memory industry can seize opportunities and empower industry innovation and development. Key speakers included Mr. Ouyang Xiaolong, Deputy Dean of Attach Point Intelligent Equipment, Mr. Xu Yonggang, CTO of Tytantest, Mr. Liu Chunyang, Business Director at Shenzhen Hemei Jingyi Semiconductor, Mr. Wang Xiaoliang, Product Manager at Shenyang Heyan Technology, and Mr. Zhao Ming, General Manager of Suzhou OKN Technology. They all shared insights on how various aspects of memory equipment, eMMC, and testing contribute to the innovation and progress of the memory industry.
Keynote Speakers at the Subforum
Pressing Ahead, Striving for Excellence: Collaborative Discourse on Innovation in the Memory Industry for “Win-Win”
Starting from the perspective of memory, the GMIF 2023 Main Forum invites leading enterprises in the industry chain, listed companies, and important guests to focus on topics such as industry trend insight, industry development strategy and innovation, and R&D of cutting-edge technology, and to share something wonderful from their respective positions and perspectives around the directions of technological innovation, process innovation, product innovation, and application innovation, to explore innovative solutions for the semiconductor or memory industry.
Mr. Song Bing, the Honorary Chairman of the Shenzhen Memory Industry Association, graced the conference with his presence and delivered a notable address. In his speech, Mr. Song eloquently characterized the memory industry as a complex ecosystem, boasting a multitude of pivotal components, extensive interconnections, and a broad expanse of influence. Within this ecosystem, memory enterprises, upstream original equipment manufacturers, platform manufacturers, and terminal manufacturers are interdependent and collaborate for mutual success. GMIF 2023 to provide industry partners with a platform for in-depth internal and cross-disciplinary exchanges, to inspire innovative thinking and cooperation opportunities within the industry.
Mr. Song Bing, the Honorary Chairman of the Shenzhen Memory Industry Association
During this forum, Alex, a seasoned analyst from JW Insights Consulting, imparted valuable insights into the storage market's impending resurgence and the new opportunities emerging in this ever-evolving landscape. The keynote address by Mr. Gou Jia Zhang, the General Manager of Silicon Motion (SMI), a globally leading memory controller manufacturer, was a notable highlight. Mr. Gou presented a comprehensive overview of SMI’s diverse array of storage solutions and their latest achievements. He elucidated how SMI’s innovations, rooted in advanced controller chips, are empowering the development of the storage industry's ecosystem. Through this, they are co-authoring a new chapter in the narrative of mutually beneficial growth alongside China's burgeoning memory sector.
As a distinguished representative among platform manufacturers, Mr. Guo Yufeng, Vice General Manager of Phytium Information Technology, provided insights into how Chinese memory chip technology is driving the digital transformation and upgrading of industries. During his keynote address, Mr. Jiang Shan, General Manager of Loongson Technology’s Guangdong subsidiary, shed light on their innovative applications, supportive solutions, and industrial ecosystem based on Loongson's independent architecture. These advancements are aimed at serving various sectors, including general informatics and industrial control, through their proprietary innovations. Representing terminal manufacturers, Mr. Xie Wangping, Vice General Manager of the Terminal Products Division at Tongfang Co., Ltd. (THTF), shared his perspectives on the development and selection of technology in the field of terminal products.
BIWIN Storage Technology, a star enterprise on the Science and Technology Innovation Board (STAR Market), represented the voice of memory chip companies. Mr. Sun Chengsi, Chairman of BIWIN Storage, elaborated on the company's ongoing implementation of the “Research and Development and Packaging and Testing Integration” 2.0 version. This involves a deep focus on the development of testing equipment and advanced packaging and testing at the wafer level, in addition to upstream investments in IC design capabilities. These strategic moves are aimed at better supporting the needs of the industry and end customers. As a leading company in the field of automation equipment in China, Mr. Ye Changlong, General Manager of Automation Equipment, introduced a fully automatic chip packaging line. This provides robust support for the automation and informatization construction of the “last mile” of factories for packaging and testing enterprises. The digital transformation of the semiconductor industry relies heavily on efficient and data-driven platforms. Mr. Ren Xianggui, Industry Solution Director for OceanStor at Huawei Technologies, shared how Huawei is accelerating the comprehensive replacement of flash memory to provide a green and reliable acceleration foundation for the semiconductor industry.
Keynote Speakers at the Main Forum
GMIF2023 adheres to the concept of “Based in China, Facing the World”, and aims to explore the frontiers of semiconductor memory technology and applications with industry chain companies, and advance together with outstanding industry partners!