According to Ijiwei.com, from September 21st to 22nd, 2023, the Global Memory Industry Innovation Forum 2023 (GMIF 2023), hosted by the China Semiconductor Investment Alliance and organized by Shenzhen Automotive Electronics Industry Association, with the cooperation of Guangdong Integrated Circuit Industry Association and the Shenzhen Semiconductor Industry Association, and managed by JW Insights Consulting (Xiamen) Co., Ltd., was held in the Renaissance Shenzhen Bay Hotel.

GMIF2023 Global Memory Industry Ecosystem Forum On-Site

On the first day of the GMIF 2023, leading companies in the memory industry’s supply chain, including terminal manufacturers, module manufacturers, packaging and testing companies, equipment, and materials suppliers, as well as representatives from investment institutions, gathered to discuss the path of global memory industry development.

Mr. Yu Bo, the Director of Marketing at Powev

In the words of Mr. Yu Bo, the Director of Marketing at Powev: “As the domestic industrial categories become increasingly comprehensive, alongside the development of design capabilities, manufacturing prowess, and the mass production of domestic memory chips, the breakthrough of these barriers has rendered our products more aligned with the aesthetic preferences and demands of domestic users. Be it in terms of product distinctiveness, articulation of brand ideology, or production costs, domestic memory module manufacturers inherently possess advantages, thereby equipping us with the capability to venture into the realm of international brands.”

Mr. Jin Ye, Vice General Manager of the Storage Division at Maxio Technology

In the eloquent words of Mr. Jin Ye, Vice General Manager of the Storage Division at Maxio: “As the SATA proportion steadily declines while PCIe continues its upward trajectory, PCIe 4.0 is poised to maintain its dominance for an extended duration. The gradual adoption of PCIe 5.0, is expected to commence in 2024 with fresh growth prospects for the market. Within this landscape, DRAM-Less SSDs, with their outstanding performance, ultra-low power consumption and heat dissipation capabilities, as well as relatively lower costs, are poised to wield a substantial competitive advantage in the PCIe 5.0 era.”

Mr. Huang Zhiwei, Vice General Manager of Quanxing Technology

Mr. Huang Zhiwei, Vice General Manager of Quanxing Technology, stated: “In the era of the ChatGPT wave, workplace scenarios demand greater capacity, higher performance, lower latency, and faster response times. This is especially true for increased storage requirements in both DRAM and NAND. It has ushered in entirely new opportunities for the storage industry.”

Mr. Han Bingdong, Vice President of Sales at InnoGrit Technology

Mr. Han Bingdong, Vice President of Sales at InnoGrit Technology, remarked: “The demand for computing power is experiencing explosive growth, and data center scale continues to expand. In this context, solid-state drives for data centers require specialized optimization and customization for specific applications to better meet the diverse array of use cases. Compared to traditional architecture solid-state drives, the key focus for memory chips manufacturers is on achieving efficiency and energy savings, thereby promoting the development and construction of green data centers.”

Mr. Zhang Fengbin, Group Leader at the Shanghai Stock Exchange South Center

Mr. Zhang Fengbin, Group Leader at the Shanghai Stock Exchange South Center, remarked: “The Sci-Tech Innovation Board (STAR Market) prioritizes the listing of technology-driven innovative enterprises that align with the national strategy for technological innovation and possess advanced, core technologies. However, these companies need to be self-reliant. We hope that these enterprises fully comprehend the STAR Market’s emphasis on cutting-edge technology. They should clearly define their role in serving the market and chart a course for future development. They must remain committed to enhancing their innovation capabilities and technical expertise, diligently advancing their research and product development efforts. Leveraging the registration-based system, they can achieve substantial leaps in their growth trajectory.”

Dr. Ouyang Xiaolong, Deputy Dean of Attach Point Intelligent Equipment

Dr. Ouyang Xiaolong, Deputy Dean of Attach Point Intelligent Equipment Co., ltd., perceives that: “With the flourishing development of technologies such as AI, cloud, supercomputing, and autonomous driving, higher-capacity and higher-bandwidth memory chips have become pivotal growth drivers in the market. Advanced packaging technologies like 3D IC, ultra-thin chip 3D stacking, and ultra-precision alignment play a vital role in enabling memory chips to break free from the constraints of Moore’s Law, achieving high capacity and bandwidth.”

Mr. Xu Yonggang, CTO of Tytantest

Tytantest CTO, Mr. Xu Yonggang, shared: “At Tytantest, we are dedicated to the core domain of semiconductor (storage/SoC) testing. We have established a comprehensive product lineup, including memory chip ATE testing machines, Burn-in testing machines, SLT testing machines, SSD module testing equipment, and DDR module testing equipment. These products cover both mass production and research and development engineering machines. They contribute to the domestic breakthrough in testing equipment for the DRAM and NAND Flash sectors, effectively reducing testing costs for our customers.”

Mr. Liu Chunyang, Business Director at Hemei Jingyi Semiconductor Technology

Mr. Liu Chunyang, Business Director at Shenzhen Hemei Jingyi Semiconductor Technology Co., Ltd., expressed: “As storage products continue to evolve towards higher capacity and faster rates, the requirements for eMMC are also increasing. The eMMC is progressing towards thinner boards, finer lines, and the integration of multiple processes to meet the demands of different product types. Hemei Jingyi, a brand specializing in the manufacture of IC packaging solutions, has its roots in the storage sector. We adhere to a self-developed technology route for packaging solutions, thereby contributing to the advancement of the storage industry.”

Mr. Wang Xiaoliang, Product Manager at HeYan Technology

Mr. Wang Xiaoliang, Product Manager at HeYan Technology, shared: “From the perspective of semiconductor packaging and testing, as memory chips continue to increase in the number of stacked layers, the relative thickness of wafer products becomes thinner, placing higher demands on equipment performance. HeYan Technology specializes in the precision cutting and processing of hard and brittle materials such as silicon, glass, ceramics, gallium arsenide, lithium niobate, and metals. In the field of memory chips, we have introduced equipment such as wafer grinding machines, precision dicing machines, and fully automatic cutting and sorting integrated machines. These tools support thinning of memory chips, precision cutting of ultra-thin memory chips, and final product cutting, continuously empowering the development of the integrated circuit industry.”

Mr. Zhao Ming, General Manager of Suzhou OKN Technology

Mr. Zhao Ming, General Manager of Suzhou OKN Technology Co., Ltd., stated: “Suzhou OKN Technology is dedicated to the development of semiconductor memory testing systems. Based on SSD application scenarios, we offer enterprises a one-stop solution for independently developed memory testing systems and product testing services. This empowers storage research and development and quality testing, covering enterprise, industrial, and consumer-level applications.”

After an extraordinary “industry feast” featuring ten industry leaders on the first day, the Global Memory Industry Innovation Forum (main forum) of GMIF 2023 on September 22nd will feature more prominent guests who will provide in-depth analysis of industry development trends and introduce new product technology achievements. We welcome your attendance.