GMIF2022 Event Registration
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INTRODUCTION
GMIF2024 Overview
On September 27, 2024, the Third GMIF2024 Innovation Summit was successfully held at the Renaissance Shenzhen Bay Hotel. The event brought together over 55 senior executives and industry experts from renowned domestic and international companies, including the School of Integrated Circuits at Peking University, Micron, Western Digital, Solidigm, Arm, UNISOC, Intel, iFlytek, Rockchip, Silicon Motion, BIWIN, Victory Giant, Allwinner, InnoGrit, Maxio, QUANXING, Montage, Applied Materials (AMAT), Lam Research, DISCO, Skyverse, Loongson Technology, and many others. The gathering saw industry leaders engage in discussions on global storage innovation and ecosystem collaboration for shared growth in the AI era.

The summit featured seven distinct events, including a closed-door seminar, innovation summit, industrial ecosystem forum, award ceremony, Bay Area Night, the global live broadcast of memory trends by brands, and golf friendship tournaments. It attracted more than 1,400 professionals from fields such as semiconductor storage equipment, packaging and testing, terminal applications, investment and financing institutions, and academic research. During the event, over 33 exhibitors from around the globe showcased more than 150 of the latest storage solutions and technological products. Additionally, the GMIF2024 Annual Awards were presented to 38 outstanding enterprises in the industry chain, highlighting the dynamic and collaborative growth of the storage sector. GMIF looks forward to working hand-in-hand with industry partners to build a more prosperous memory ecosystem in the future!
HIGHLIGHTS
Industry Leaders Share Insights on the Direction of Industrial Technology Innovation
The summit invited global original manufacturers to share developments in NAND Flash and DRAM technologies and explore how advanced memory technologies like CXL and LPCAMM are driving innovation and applications in the AI industry.
Decoding Global Storage Industry Trends
The summit brought together representative enterprises from all segments of the memory industry chain to decode development trends of global storage industry and seize opportunities and challenges brought by changes in the storage industry cycle.
Capital Market matchmaking and Strategy Sharing to Explore Investment Opportunities
The summit enabled face-to-face exchanges between listed companies, unicorns in the memory industry chain, and investment institutions to highlight investment value, delve into new sectors and opportunities, and foster win-win cooperation.
Diverse Event Formats and Media Resources to Empower Business Success
The summit worked to facilitate efficient interactions across the industry chain by participation in keynote speeches, thematic matchmaking meetings, awards ceremonies, Bay Area Nights, friendly golf matches and global live broadcasts.
SPEAKERS
Yimao Cai
Dean, School of Integrated Circuits
Peking University
Prasad Alluri
VP and GM for Client Storage, SBU
Micron Technology
Yan Li
VP of Advanced Technology                                                                                                      
Western Digital
Wallace C. Kou
President & CEO
Silicon Motion
Benny Ni
GAR Sales VP
Solidigm
Zhinong Liu
EVP
UNISOC
Haibing Xie
Director
Application Design In Center, Intel China
Hui Wang
Vice General Manager
Victory Giant Technology
Sam Sun
Chairman
BIWIN Storage
Rui Ding
General Manager, Product Department,
Consumer Cloud Platform 
Business Group
iFLYTEK
Chloe Ma
VP, China GTM for IoT Line of Business
Arm
Feng Chen
Senior Vice President
Rochchip
Jie Chen
VP of Data Storage Technology
InnoGrit
Vic Huang
Vice General Manager
Quanxing Technology
Zheng Qiu
Technical Marketing Manager
Montage Technology
Don Hu
VP of Marketing
Allwinner Technology
Lei Hu
Director, Business Management
AMAT
Lee Chee Ping
Senior Director
LAM Research
YOUNGSUK KIM
Director
DISCO
Song Zhang
EVP
Skyverse
Shan Jiang
General Manager
Guangdong Loongson Electronic 
Technology
Simon Ye
General Manager
Like Automation Equipment
Steve Pei
CEO
Micro-Nano (HongKong) Technology
Ming Zhao
General Manager
OKN TECHNOLOGY
Kuilin Jin
Vice General Manager of Sales
Maxwell Technologies
Xiaolong Ouyang
R&D VP
Attach Point Intelligent Equipment
Aaron Xu
CTO
Tytantest
Huan Ren
Marketing Director
Maxio Technology
Leo Cao
Senior Sales Director
Silergy Technology
Kent Wang
Business Development Manager
Shenyang Heyan Technology
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Global Live Stream
agenda
The 3rd GMIF2024 Innovation Summit (Main Forum)   September 27

The summit will bring together leading enterprises, listed companies, and local representatives from the semiconductor memory and AI industry chains. Focusing on the recovery of the memory market and the evolving industry landscape and trends driven by AI applications, the summit will showcase cutting-edge technologies and the latest products, discuss how to collaborate and innovate in the upstream and downstream of the industry chain, and explore ways to build a win-win industrial ecosystem.


 

08:30~09:00
Registration
09:00~09:05
Opening Address
Rixin Sun | President, Shenzhen Memory Industry Association (SMIA)
09:05~09:15
Memory Industry Status Brief Introduction: How AI Affects Memory Industry
Alex | Chief Analyst, Shenzhen Memory Industry Association (SMIA)
09:15~09:35
The Evolution of Memory and In-Memory Computing Technologies in the AI Era
Yimao Cai | Dean, School of Integrated Circuits, Peking University
09:35~09:55
Data Is at the Heart of AI: Micron Memory & Storage Are Fueling the AI Revolution
Prasad Alluri | VP and GM for Client Storage, SBU, Micron Technology
09:55~10:15
3D QLC NAND Flash Scaling and Its Application
Yan Li | VP of Advanced Technology, Western Digital
10:15~10:35
AI Craze: Data Dominance, Silicon Motion's AI Storage Strategy
Wallace C. Kou | President & CEO, Silicon Motion
10:35~10:55
Accelerate Storage Innovation, Embrace the AI Era
Benny Ni | GAR Sales VP, Solidigm
10:55~11:15
The Development and Challenges of Semiconductor Manufacturing Technology
Zhinong Liu | EVP, UNISOC
11:15~11:35
AI PC Evolution
Haibing Xie | Director, Application Design In Center, Intel China
11:35~11:55
The Future of Storage in the AI Era
Hui Wang | Vice General Manager, Victory Giant Technology
12:00~13:50
Lunch Break
13:30~14:00
Registration
14:00~14:20
Integrated R&D and Packaging 2.0 Strategy: Full Industry Chain Layout Empowering Client Value Elevation
Sam Sun | Chairman, BIWIN Storage
14:20~14:40
AI Pioneers a New Era in Smart Hardware
Rui Ding | General Manager, Product Department, Consumer Cloud Platform Business Group, iFLYTEK
14:40~15:00
Empowering AI: The Crucial Role of Next-Generation Storage and Memory Solutions
Chloe Ma | VP, China GTM for IoT Line of Business, Arm
15:00~15:20
The Challenges of AIoT for SoC and Storage
Feng Chen | Senior Vice President, Rochchip
15:20~15:40
Exploring CXL Technology in Next-Generation Storage
Jie Chen | VP of Data Storage Technology, InnoGrit
15:40~16:00
Open the "Quan" People AI Era of Storage and Computing Integrated Solution
Vic Huang | Vice General Manager, Quanxing Technology
16:00~16:20
CXL Memory Expansion Solution
Zheng Qiu | Technical Marketing Manager, Montage Technology
16:20~16:40
High Performance Computing Empowers Industrial Smart Applicances
Don Hu | VP of Marketing, Allwinner Technology
16:40~17:00
Integrated Development Center Provides Robust Collaboration for Memory Industry
Lei Hu | Director, Business Management, Applied Materials
17:00~17:20
Memory Evolution: Innovative Equipment Solutions for Emerging Packaging Technologies
Lee Chee Ping | Senior Director, LAM Research
17:20~17:40
Advanced Thinning and Cutting Solutions for the AI Era
YOUNGSUK KIM | Director,  DISCO
Memory Industry Chain Ecosystem Forum   September 27

The forum will invite representative enterprises of local memory industry chain to discuss the synergy and development of local memory industry chain and share the latest market dynamics and technology trends.



 

13:00~14:00
Registration
14:00~14:20
Artificial Intelligence Software in Wafer Inspection
Song Zhang | EVP, Skyverse
14:20~14:40
Promoting Industry Market Prosperity with 'Jianbing Jianke' Products
Shan Jiang | General Manager, Guangdong Loongson Electronic Technology
14:40~15:00
Integrated Solution for Storage, Sealing, Testing, Planting, and Ball Replenishment
Simon Ye | General Manager, Like Automation Equipment
15:00~15:20
SENTRONICS Wafer Measurement Systems Help Improve Yield of Production in HBM and Advanced Packaging Fields
Steve Pei | CEO, MICRO-NANO (HONGKONG) TECHNLOGY
15:20~15:40
Testing Technology Energize High-Quality Development of the Storage Industry
Ming Zhao | General Manager, OKN TECHNOLOGY
15:40~16:00
Maxwell High-End Semiconductor Equipment and Integrated Solution
Kuilin Jin | Vice General Manager of Sales, Maxwell Technologies
16:00~16:20
One-Stop Solution for Memory Die Bonders—From Flash to DRAM
Xiaolong Ouyang | R&D VP, Attach Point Intelligent Equipment
16:20~16:40
Aging Testing of Storage Chips in Emerging Trends
Aaron Xu | CTO, Tytantest
16:40~17:00
Consumer SSD Industry Solutions and Applications
Huan Ren | Marketing Director, Maxio Technology
17:00~17:20
Silergy High-Efficiency and High-Integration Power IC Helps the Storage System to Reduce Cost and Increase Efficiency
Leo Cao | Senior Sales Director, Silergy Technology
17:20~17:40
Ultra-Thin Wafer Thinning Solutions
Kent Wang | Business Development Manager, Shenyang Heyan Technology
organization
Host Units
China Semiconductor Investment Alliance
Shenzhen Memory Industry Association
Co-organizers
Guangdong Integrated Circuit Industry Association
Shenzhen Semiconductor Industry Association
Organizers
JW Insights Consulting (Xiamen) Co., Ltd.
Haitong Securities Co., Ltd.
address
Renaissance Shenzhen Bay Hotel, Shenzhen, China
Block A, Building 12, Shenzhen Bay Eco-Technology Park, No. 18 Keji South Road, Nanshan District, Shenzhen, Guangdong, China
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