The year 2025 marks a pivotal moment in the accelerated adoption of artificial intelligence (AI). The rapid uptake of intelligent terminals—such as AI PCs, AI smartphones, and AI servers—has fueled the rise of innovative applications, including generative AI, autonomous driving, AI glasses, and embodied AI. Amid this evolution, storage systems have emerged from the background to take the center stage, serving as a key underpinning for enhancing AI experiences and driving systemic transformation. In the face of the high demands of bandwidth, power consumption, latency, capacity and dimension across diverse AI-driven scenarios, significant breakthroughs have been achieved in new-generation high performance storage technologies like LPDDR5X/DDR5, QLC NAND, LPCAMM, and CXL. Integrated innovations in chip design, controller algorithms, and packaging and testing processes are propelling the industry into a new phase of AI-driven transformation.

In this dynamic context, the "Fourth GMIF2025 Innovation Summit (Global Memory Innovation Forum)", co-hosted by the Shenzhen Memory Industry Association and the School of Integrated Circuits at Peking University and organized by JW Insights Consulting (Xiamen) Co., Ltd., is scheduled to be held on September 24–25, 2025, at the Renaissance Shenzhen Bay Hotel. Under the theme of "AI Applications, Innovation Empowered", the summit will delve into three key topics, specifically emerging trends in storage technologies, real-world AI applications, and collaborative innovation across the storage industry chain. Representative enterprises across all segments of storage ecosystem, comprising wafer IDM manufacturers, controller and module suppliers, packaging and testing providers, and AI platform vendors, will come together to collectively explore innovation pathways and ecosystem development in the AI era.