The Fourth GMIF2025 Innovation Summit (Global Memory Innovation Forum), co-hosted by the Shenzhen Memory Industry Association and the School of Integrated Circuits at Peking University and organized by JWinsights (Shanghai) Technology Co., Ltd., successfully wrapped up recently in Shenzhen.
As one of the annual grand events in the global storage industry, more than 20 leading companies had participated in the booth session to demonstrate their latest products and solutions, covering DRAM, NAND Flash, controllers, memory modules, equipment/materials and AI intelligent terminals. This provided an efficient platform for technical exchange and business cooperation for enterprises, universities, institutions, and professionals in the global storage field, earning high acclaim from the industry.
Sandisk
As a global leader in flash memory solutions, Sandisk holds over 4,900 U.S. patents and delivers a comprehensive portfolio spanning consumer, enterprise, and automotive-grade applications. Its core technologies—such as the 218-layer BiCS8 TLC NAND and CBA architecture—ensure industry-leading performance in speed, density, and cost efficiency. Sandisk spotlighted its high-performance consumer and embedded solutions. Its Extreme PRO® series features compact design, large capacity and high speed; the exhibited eMMC and UFS embedded chips address the high compatibility and low-power requirements of smart terminals and IoT devices, while also supporting wide-temperature operation for automotive and industrial use cases. Altogether, the display underscored Sandisk's strong innovation capability and strategic presence across the global storage market.
Intel (China) Co., Ltd.
Intel is a global leader in the fields of semiconductors and computing innovation, renowned for its x86 architecture processors, which have driven the development of personal computers, the internet, and cloud computing. The Core Ultra 200 series launched in 2025 features an integrated GPU and NPU forming an AI acceleration engine, with local AI computing power reaching up to 99 TOPS. Intel booth exhibited its smart PC assistant, which enables to switch songs, search for images, change wallpapers, and control system components only through voice command by calling "Cherry, Cherry". In addition, its variable video memory technology driven by Intel latest GPU expands capacity of 32GB notebooks to 87%, capable of supporting smooth operation of 30B MOE models and improving local work efficiency.
Solidigm
Solidigm has focused on AI, cloud computing, and data centers since 2024. Bolstered by its core competitiveness of QLC (Quad-Level Cell) SSD technology, it has cumulatively shipped over 100EB of QLC products spanning global-leading OEM AI solution providers. Solidigm highlighted its enterprise-grade solutions, especially for AI and data center demands. The exhibits include large QLC SSD (i.e. the 122.88TB version) represented by D5-P5336, which stands out for its high density and low power consumption, ideal for scenarios such as data lake and CDN (content delivery network); PCIe Gen5 high-performance SSDs that support high-concurrency data access for AI training; and first-in-class cold-plate liquid-cooled enterprise-grade SSD prototype developed in collaboration with NVIDIA, supporting hot-swapping and dual-sided heat dissipation, adapted to full-liquid-cooled fanless AI server architectures. This fully demonstrated the company's technological innovation and solution capabilities in the field of enterprise-grade storage.
KIOXIA
As a pioneer in 3D flash technology, KIOXIA's in-house BiCS FLASHTM technology has iterated to its 8th version and the 9th and 10th generation are under development and sampling, covering multiple memory demands from TLC to QLC, suitable for emerging applications such as AI and cloud computing. KIOXIA has built an all-scenario product matrix: consumer-grade includes high performance SSD and memory cards; enterprise-grade comprises ultra-large capacity LC9 series NVMe SSD and CD9P series for AI computing; the embedded covers UFS and eMMC; and automotive-grade products can meet wide-temperature operation requirements from -40°C to 105°C, adapted to smart cockpits and ADAS systems. Through an open innovation ecosystem, its PCIe 5.0 SSD RAID solution developed in collaboration with companies like Xinnor can significantly improve database performance in AI scenarios, while also exploring cutting-edge technologies such as CXL interfaces and liquid-cooled storage.
Silicon Motion Technology Corp.
As a leading player in NAND Flash controllers, Silicon Motion leverages over 20 years of expertise to build a competitive edge across technology, scenario adaptation, and ecosystem collaboration. From optimizing compatibility for different flash processes to innovating firmware for QLC and other new architectures, the company's precise control of flash characteristics forms a unique technical advantage.
Silicon Motion has developed the industry's broadest controller IP portfolio. By combining and customizing IP, it delivers targeted solutions that reduce development costs and accelerate time-to-market for both entry-level and high-performance storage products.
At this showcase, Silicon Motion presented the SM2504XT controller, positioned as the "next-generation flagship for AI PCs." Display boards also featured solutions for enterprise and mobile storage, demonstrating high-performance storage technologies designed for AI workloads and diverse application scenarios.
InnoGrit Corporation
Founded in 2017, InnoGrit Corporation is deeply engaged in controllers and SSD solutions, and has rapidly become a benchmark in China's storage industry, recognized as a national "Little Giant" in innovation. With nine storage chips developed over seven years, the company covers the full stack from SATA to PCIe 5.0 across consumer, enterprise, and industrial applications.
For the AI era, InnoGrit showcased its Dongting-N3 PCIe 5.0 SSD series and N3X edge-computing storage solutions, offering low latency, high durability, and full support for AI training and inference. It has collaborated closely with YMTC to achieve full “controller-to-medium” localization, and its products are compatible with domestic CPUs such as Kunpeng and Hygon. Deployments include Shanghai Bank and Postal Savings Bank, with international reach in over 30 countries.
The booth also highlighted the YRS820 PCIe 5.0 consumer controller (mainland China’s first mass-produced RISC-V controller), and a fully localized SSD ecosystem co-developed with YMTC and other domestic partners. These innovations demonstrate InnoGrit’s leadership in storage technology and its competitiveness in global markets.
Maxio Technology (Hangzhou) Co., Ltd.
As one of the world's top three SSD controller and solution providers, Maxio Technology has expanded into UFS and eMMC controllers, becoming one of the few companies mastering core NAND Flash control technologies. Its patented Flash Adaptation Technology enables full compatibility with NAND from all major global manufacturers, including Kioxia, Micron, Samsung, SK hynix, Solidigm, Western Digital, and YMTC.
Maxio's products span consumer, enterprise, embedded, and automotive applications, developed in close collaboration with global NAND and storage partners. The company is also advancing toward next-generation "storage-compute integration" for AI-driven architectures.
At the event, Maxio showcased its next-generation PCIe/NVMe controllers, SSD modules, and complete storage solutions built around its controller ecosystem. Demonstrations included compatibility with various NAND types and performance optimization technologies, underscoring Maxio's strong technical leadership and solution capabilities in the controller domain.
Montage Technology Co., Ltd.
Montage Technology focuses on providing high-performance interconnect solutions for cloud computing and AI infrastructure. On the technology and market front, Montage Technology plays a leading role in setting technical standards, product layout and market performance. It's also one of a few manufactures that master technologies covering full range of DDR2 to DDR5 memory interfaces. Montage pioneered the DDR4 "1+9" architecture adopted by JEDEC as an international standard and led the development of key DDR5 chip standards, securing a strong voice in the industry. It is one of only two global suppliers offering a complete DDR5 chip lineup and, by 2024 revenue, the world's largest supplier of memory interconnect chips and one of the two major suppliers of PCIe Retimer chips.
Montage booth showcased its memory interface chips, PCIe Retimer chips, CXLMXC chips, and components from the Jintide® server platform, allowing visitors to experience firsthand the design, scale, and performance of its high-speed interconnect solutions.
BIWIN Storage Technology Co., Ltd.
BIWIN Storage (STAR Market: 688525), a listed company and a constituent of the STAR 50 Index, specializes in the R&D, design, packaging, testing, and sales of semiconductor storage products. With strong capabilities in controller design, storage media research, firmware algorithm development, advanced packaging and testing, and test equipment innovation, BIWIN has established a fully "Integrated Solution and Manufacturing" industrial chain layout.
Its product lineup spans embedded, PC, industrial & automotive, and enterprise storage, as well as advanced packaging services, serving diverse applications across AI edge devices, mobile terminals, PCs, smart vehicles, and data centers. In 2024, the company achieved revenue of RMB 6.695 billion, with AI-edge business exceeding RMB 1 billion, up approximately 228% year-on-year, powering products such as smartwatches, AI glasses, and AI learning devices for global leaders including Meta, Google, and Xiaomi.
Topdisk Technology Limited
TOPDISK specializes in NAND Flash storage products under its TOPDISK and SmartFlash brands, covering R&D, packaging, testing, manufacturing, and sales. Its product lineup includes SSDs, microSD cards, eMMC, and USB drives, widely applied in AI, IoT, rail transit, and smart terminals.
With chip-level development capability, a top-tier R&D team, and advanced packaging and testing facilities, the company delivers over 20 million high-quality flash products annually. It maintains long-term partnerships with major global NAND and controller manufacturers, with a business network spanning worldwide.
At the exhibition, TOPDISK showcased a diverse range of storage solutions, including SSDs, portable SSDs, USB drives, and AI-oriented storage products. These offerings address needs in high-speed transmission, data storage, and intelligent applications, demonstrating the company's comprehensive layout and innovation strength in the NAND Flash field.
Shenzhen KingSpec Electronics Technology Co., Ltd.
KingSpec Electronics, founded in 2007, operates under a dual-brand strategy: KingSpec, focusing on consumer markets such as office, gaming, and video production; and YANSEN, dedicated to industrial-grade applications in security surveillance, rail transit, and other demanding environments. Its product portfolio covers internal SSDs, portable SSDs, memory modules, and professional video storage, offering a full range of SSD solutions with OEM/ODM customization services.
Headquartered in Shenzhen, KingSpec has established service centers in over 100 countries and regions, partnering with leading enterprises such as Tsinghua Tongfang and Mindray. Backed by two R&D centers and certified by ISO 9001, FCC, and CE, the company has built a complete design-to-manufacturing capability, driving the intelligent upgrade of China's storage industry.
Powev Electronic Technology Co., Ltd.
POWEV, a leading Chinese storage module manufacturer, was founded in 2012 and has developed a full range of storage products. Its core brands, including GLOWAY, offer high-end solutions such as DDR5 memory at 6000MHz and PCIe 5.0 SSDs, achieving full in-house control from chip screening to module manufacturing. As a diamond-level ecosystem partner of YMTC's Xtacking 3D NAND, POWEV collaborates closely with Hefei Changxin and Loongson Technology to develop fully localized storage solutions, already integrated into systems from Sugon and Tsinghua Tongfang. Following tens of millions in strategic investment in 2024, the company has launched its IPO plans. Its self-developed "Yinxin-1" DRAM testing equipment breaks foreign monopolies and strengthens domestic capabilities across consumer and server-grade storage.
Shenzhen Quanxing Technology Co., Ltd.
Quanxing Technology focuses on the chip packaging & testing, R&D, production, and global sales. Operating in both DRAM and NAND Flash domains, the company masters core technologies such as SiP system-level packaging and 8-die stacking, and its self-developed DDR5 IC testing software fills a domestic gap. As a provider of full-range high-end storage solutions, Quanxing offers products across consumer, enterprise, and automotive-grade storage modules, with automotive-grade storage cards already under verification by leading domestic car manufacturers. At the exhibition, the company showcased a range of SSD products, including 2.5-inch SATA SSDs, U.2 PCIe 5.0 QLC SSDs, and high-end enterprise SSDs, highlighting its technical layout and strength in enterprise storage solutions.
NAURA Technology Group Co., Ltd.
NAURA is China's largest and most diversified semiconductor equipment provider. Its core business focuses on equipment R&D, with products spanning etching machines, thin-film deposition (PVD/CVD), furnaces, and cleaning systems, covering the full spectrum of semiconductor manufacturing equipment. The company has launched the NMC612DICP etcher for 14nm FinFET processes, with extension capability to 7/5nm nodes, and developed the 12-inch Cygnus PECVD series, meeting critical process requirements for storage chip passivation and isolation layers.
Shenzhen Interposer Technology Co., Ltd.
Interposer is a high-tech enterprise specializing in the development of core semiconductor packaging components. Its products support advanced storage chip packaging and can also be applied in optical modules, meeting the strict bandwidth and stability requirements of AI server storage systems. As a key supplier in the storage packaging segment, Interposer's solutions enhance chip integration and signal transmission efficiency, providing essential connectivity support to upstream and downstream partners such as NAURA and Hemei Jingyi, and accelerating the localization of storage packaging in China.
Microview Intelligent Packaging Technology (Shenzhen) Co., Ltd.
Microview is a high-tech enterprise focused on developing core semiconductor packaging equipment, specializing in high-precision die-bonding machines. Its equipment achieves micron-level accuracy, supporting advanced packaging scenarios for storage chips, optical modules, and more, addressing industry challenges such as placement deviation and insufficient stability for small-size chips. Its products have been widely used in leading optical module manufacturers and storage packaging companies with enhanced production efficiency and yield. Particularly in advanced processes like 3D stacked packaging, its equipment enables higher storage chip integration and supports the localization of semiconductor packaging equipment in China.
Dongguan Attach Point Intelligent Equipment Co., Ltd. (APIE)
APIE, founded in 2016, is a leading developer of high-precision semiconductor packaging equipment, focusing on storage chips and optical modules. Supported by seven underlying technology pillars, the company has achieved three domestic "firsts": the first mass-produced CMOS die-bonder, fully automated COB packaging line, and multi-layer ultra-thin BGA die-bonder. Its storage chip stacking equipment supports advanced processes such as 3D stacking. As a key supplier in storage packaging, APIE's products are recognized by leading storage companies. With over RMB 100 million invested in R&D, the company has broken foreign technology monopolies, providing critical equipment to enhance storage chip integration and advance the localization of packaging solutions in China.
Shenzhen Like Automation Equipment Co., Ltd. (LKAUTO)
LKAUTO is a high-tech enterprise specializing in back-end semiconductor packaging equipment. Its core products include wafer dicing machines, grinding equipment, and automated solutions, specifically tailored for storage chip packaging processes. As a fast-growing domestic player in semiconductor packaging, LKAUTO serves leading Chinese storage packaging and testing companies, providing critical manufacturing support from wafer to finished module, and driving the localization of storage packaging equipment.
AMIES Technology Co., Ltd.
AMIES, established in February 2025 as a spin-off from Shanghai Micro Electronics Equipment (Group) Co., Ltd. (SMEE), is an innovative enterprise specializing in high-end semiconductor equipment. The company focuses on IC front-end manufacturing, advanced packaging and testing, third-generation semiconductors, and new display technologies. Its main products include high-resolution, large exposure field advanced packaging lithography systems, laser annealing tools for power and logic devices, and wafer inspection systems capable of detecting multiple defect types, as well as bonding and panel exposure equipment.
Shenzhen Hemei Jingyi Semiconductor Technology Co., Ltd.
With over a decade of industry expertise, Hemei Jingyi has established itself as a leader in IC packaging substrates. The company operates production bases in Shenzhen, Jiangmen, and Zhuhai, supported by a dedicated PCB industrial park and in-house environmental systems. As one of the few domestic manufacturers capable of mass-producing IC packaging substrates with fully independent and controllable technology, it focuses on storage chip packaging substrates, spanning flash memory substrates, LGA substrates and more, being widely used in smartphones, servers, and automotive electronics. The company has also been a part of supply chain of enterprises such as KYEC, HT-Tech, and BIWIN Storage, growing to be a core supplier of memory and non-memory packaging substrates and playing a key role in breaking foreign monopolies.
At GMIF2025 Hemei Jingyi showcased a diverse range of IC packaging substrates, including eMCP substrates for integrated memory and storage functions in mobile devices, and JL coreless substrates that meet the ultra-thin and lightweight requirements of portable electronics. The products cover applications in AI, wearables, and automotive electronics, demonstrating the company's strong technical expertise and comprehensive product capabilities in IC packaging substrates.
Suzhou Maxwell Technologies Co., Ltd.
Suzhou Maxwell Technologies Co., Ltd., as a core innovator in China’s advanced semiconductor packaging equipment sector, specializes in 2.5D and 3D packaging process solutions and has developed a comprehensive lineup of wafer processing equipment covering the full manufacturing flow. In the memory packaging domain, Maxwell has taken the lead in domestic localization of laser grooving, laser modification cutting, and blade dicing equipment. Its 12-inch wafer thinning and dry polishing-integrated systems have been successfully delivered and validated by leading packaging enterprises such as HT-Tech.
Suzhou OKN Technology Co., Ltd.
Founded in 2005, OKN Technology is a national high-tech enterprise deeply engaged in the semiconductor memory testing field. With independent R&D at its core, the company has mastered fundamental technologies and achieved iterative breakthroughs from HDDs to SSDs, and from DRAM/NAND chips to LPDDR/UFS embedded products. OKN has built a comprehensive solution portfolio covering automated test equipment, software platforms, and test fixtures. Its products and services are widely applied in the semiconductor, 3C, and automotive industries, serving renowned clients such as YMTC, Seagate, Inspur, and Lenovo. Through subsidiaries in Shenzhen and Anhui, OKN continues to enhance its full-chain service capability.
OKN showcased a range of memory testing solutions, including the GA300 and SW400 series. These systems provide testing coverage from chip-level to storage modules, meeting diverse testing needs and underscoring the company's one-stop capability in semiconductor memory testing.
Shenyang Heyan Technology Co., Ltd.
Heyan Technology, established in 2011, is a national-level specialized and innovative enterprise engaged in the R&D, production, sales, and service of semiconductor equipment and consumables. Its core products include HG-series wafer grinding machines, DS-series precision dicing machines, JS-series fully automatic integrated cutting and sorting machines, serving multiple sectors such as integrated circuits, optoelectronic devices, and discrete components. Through years of accumulation, the company wins the first place in market share of wafer dicing machines at home and the second worldwide. Its competitiveness in semiconductor grinding and dicing machines provides critical support for the memory industry and contributes to the localization of semiconductor manufacturing equipment.
Skyverse Technology Co., Ltd.
Skyverse is a leading enterprise in China's high-end semiconductor quality control equipment sector, specializing in the research and development of inspection and measurement devices. Its core product offerings include nine major series, such as non-patterned wafer defect inspection, patterned wafer defect inspection, and 3D surface profiling metrology, which are already in mass production and have been deployed in the 28nm and above production lines of top-tier storage companies, including YMTC and JCET.
Tytantest Co., Ltd.
Tytantest is a high-tech enterprise focused on semiconductor memory testing, with a core team bringing over a decade of R&D experience from leading global semiconductor companies. As an affiliated company of BIWIN Storage, Tytantest specializes in developing ATE testing systems and burn-in testers for memory chips. Its Ty-Flex solution enables efficient, multi-type memory testing, helping clients enhance productivity and reduce costs. Centered in Chengdu High-Tech Zone as its main R&D and manufacturing base, Tytantest provides in-depth services for memory chip manufacturers and packaging & testing companies, driving the localization of semiconductor testing equipment through independent technological innovation.
Silergy Corp.
Silergy, though not directly focusing on core storage technologies, underlies the the stability and performance optimization of storage systems by providing supplementary products or services. Its semiconductor power management ICs provide reliable power delivery under complex operating conditions, supporting the efficient operation of storage chips and serving as an indispensable part of the storage ecosystem.
As a global leader in analog semiconductors, Silergy specializes in the R&D and design of analog ICs, with "miniaturization, high efficiency, and intelligence" as its core philosophy. The company has developed a diverse product portfolio covering power management, signal processing, RF, and sensing technologies, serving key industries including consumer electronics, industrial control, automotive electronics, and cloud computing.
Silergy showcased two PMIC products—the SY8686 and SY70202A—designed for power management in SSDs and microcontrollers. Both feature multiple synchronous buck channels and integrate input/output overvoltage, short-circuit, and thermal protection to ensure stable operation under demanding conditions. Compactly designed in CSP packages, these solutions meet the requirements of highly miniaturized hardware designs, exemplifying Silergy's strength in innovation and application excellence in the power management IC field.
Industry Chain Gathered to Build an Innovation-Driven Storage Technology Ecosystem
Shenzhen Memory Industry Association (SMIA), the summit organizer, had released a industry ranking list to recognize outstanding innovators in partnership with School of Integrated Circuits from Peking University and other institutions, further promoting coordinated development across the memory industry chain.
Serving as a vital bridge connecting government, enterprises, and research institutions, SMIA plays a central role in resource integration, standard formulation, ecosystem building, and policy coordination. Through these efforts, SMIA facilitates technical collaboration and demand matching among upstream and downstream enterprises, accelerates the commercialization of technological achievements, and enhances the global influence of domestic enterprises—fostering a favorable environment for the development of China's memory industry.
The exhibition brought together leading companies from across the entire memory industry chain—from wafer manufacturing to end applications—creating an innovation-driven ecosystem for memory technology. This year's showcase not only highlighted the industry's shift from capacity-driven to AI performance-oriented storage solutions but also strengthened cross-enterprise collaboration in process advancement, ecosystem compatibility, and application adaptation.
In response to the demands of the AI era—ranging from high-performance PCIe 5.0/6.0 SSDs for data-intensive computing to low-latency edge storage and automotive-grade wide-temperature memory products—the entire industry chain is advancing toward higher performance, lower power consumption, and greater intelligence. Together, these innovations are reinforcing the storage foundation essential to the growth of the global digital economy.